Thermo-mechanische und mikrostrukturelle Charakterisierung von Kupfer-Durchkontaktierungen im Silizium (Through Silicon Vias)
| Autor | Peter Sättler |
|---|---|
| Verlag | GRIN Verlag |
| Erscheinungsjahr | 2016 |
| Seitenanzahl | 147 Seiten |
| ISBN | 9783668211377 |
| Format | |
| Kopierschutz | kein Kopierschutz/DRM |
| Geräte | PC/MAC/eReader/Tablet |
| Preis | 14,99 EUR |
wissenschaftliche Veröffentlichungen: Konferenzbeiträge: 2014 P. Saettler, M. Hecker, M. Boettcher, C. Rudolph, and K. J. Wolter, 'TSV-Annealing?: A thermo-mechanical assessment,' in Electronics System-Integration Technology Conference (ESTC), 2014, pp. 1-6. 2013 P. Saettler, M. Boettcher, C. Rudolph, and K. J. Wolter, 'Bath chemistry and copper overburden as influencing factors of the TSV annealing,' in Proceedings - Electronic Components and Technology Conference, 2013, pp. 1753-1758. P. Saettler, M. Boettcher, and K. J. Wolter, 'µ-Raman spectroscopy and FE-analysis of thermo-mechanical stresses in TSV periphery,' in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013, 2013, pp. 1-7. 2012 P. Saettler, M. Boettcher, and K. J. Wolter, 'Characterization of the annealing behavior for copper-filled TSVs,' in Proceedings - Electronic Components and Technology Conference, 2012, pp. 619-624. P. Saettler, D. Kovalenko, K. Meier, M. Roellig, M. Boettcher, and K. J. Wolter, 'Thermo-mechanical characterization and modeling of TSV annealing behavior,' in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, 2012, pp. 1/6-6/6. 2011 P. Saettler, K. Meier, and K. J. Wolter, 'Considering copper anisotropy for advanced TSV-modeling,' in Proceedings of the International Spring Seminar on Electronics Technology, 2011, pp. 419-423. Fachzeitschriften: 2015 P. Saettler, M. Hecker, M. Boettcher, C. Rudolph, and K. J. Wolter, 'µ-Raman Spectroscopy and FE-Modeling for TSV-Stress-Characterization,' Microelectron. Eng., pp. 1-7, 2015. 2013 P. Saettler, M. Boettcher, C. Rudolph, and K.-J. Wolter, 'Thermo-mechanische Charakterisierung des TSV-Annealing,' Produktion von Leiterplatten und Syst., no. 7, pp. 1498-1507, 2013.
